Our "Flexible Circuit Design Guide" shows requirements for materials, product performance, and quality of Lenthor's Flexible Circuits.
Request the Design Guide >Flex Assembly
| Soldering Process | |||
|---|---|---|---|
Clean No-Clean RoHS (Clean) RoHS (N0-Clean) |
SMT Yes Yes Yes Yes |
Wave Yes Yes Yes Yes |
2nd OP Yes Yes Yes Yes |
| SMT Capabilities Proto turn around time Max Component count Chip Component BGA/CBGA/CCGA CSP LCC PGA LGA IC/TSOP/QFP |
Start shipping the 5th day after kit complete Bottom side: Max 50 line items Top side: Max 50 line items Down to 0201 Min pitch: 16 mils Max I/O: 50 mm (2,000 ball counts) Min pitch: 16 mils Max I/O: 50 mm (2,000 ball counts) Yes Yes Yes Min pitch 16 mils |
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| Board Size Max / Min. Dimension Max / Min. Thickness Flex / Rigid-Flex |
18 x 20 inches 6.00 mm Yes |
3 x 3 inches 0.20 mm Yes |
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| DEM / Stencil / Fixture Proto turn around time Max Component count Chip Component |
Start shipping the 5th day after kit complete Bottom side: Max 50 line items Top side: Max 50 line items Down to 0201 |
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| Equipment List Solder Paste Printer Pick and Place Reflow Oven Wave Solder Solder Paste Inspection AOI BGA Rework X-Ray 3-DX Baking Oven Stencil Cleaner Aqueous Cleaner Selective Solder |
DEK Universal Vitronics Vitronics Evaluating Evaluating Out Source Focal Spot N/A Blue M Electric Despatch Evaluating Technical Devices KISS-104 |
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Lenthor Engineering announced on Monday, September 24 their entry into the EMS arena. After 23 years of successfully fulfilling the needs of the flex and rigid-flex printed circuit board fabrication market Lenthor Engineering has, with the execution of their $850k capital expenditure plan, expanded their services to include component placement assembly. By affecting this plan, Lenthor Engineering is providing the marketplace with a single-sourced flex and rigid-flex focused board fabrication and assembly facility. The equipment procurement decisions were based on providing our customers with a very high level of technical capability supporting both production and quick-turn engineering requirements.
The equipment list contains the following:
- DEK Solder Paste Printer
- Universial Component Placement
- Vitronics Reflow Oven
- Vitronics Delta Wave Solder
- Technical Devices Aqueous Cleaner
- FocalSpot X-Ray
- KISS 104 Selective Solder
The resulting equipment offering provides our customers with the ability to meet a wide range of component placement needs:
- 0201 Component Package
- 0.4mm (16 mil) Pitch
- Through Hole
- BGA, CCGA, CSP and Odd Shape Connector
- Lead Free (RoHS Compliant)
- Aquelous and No Clean
- PIH (Paste in hole)
- Press Fit Connector Installation
- Single and Double-Sided
Now there is no more need for second guessing your fabrication and assembly source decisions.
