Lenthor Engineering Design Guide

Our "Flexible Circuit Design Guide" shows requirements for materials, product performance, and quality of Lenthor's Flexible Circuits.

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Lenthor Assembly

Soldering Process

Clean
No-Clean
RoHS (Clean)
RoHS (N0-Clean)
SMT
Yes
Yes
Yes
Yes
Wave
Yes
Yes
Yes
Yes
2nd OP
Yes
Yes
Yes
Yes
SMT Capabilities
Proto turn around time
Max Component count
Chip Component
BGA/CBGA/CCGA
CSP
LCC
PGA
LGA
IC/TSOP/QFP

Start shipping the 5th day after kit complete
Bottom side:   Max  50 line items   Top side:  Max 50 line items
Down to 0201
Min pitch:  16 mils   Max I/O:  50 mm (2,000 ball counts)
Min pitch:  16 mils   Max I/O:  50 mm (2,000 ball counts)
Yes
Yes
Yes
Min pitch  16 mils

Board Size
Max / Min. Dimension
Max / Min. Thickness
Flex / Rigid-Flex

18 x 20 inches
6.00 mm
Yes

3 x 3 inches
0.20 mm
Yes
DEM / Stencil / Fixture
Proto turn around time
Max Component count
Chip Component

Start shipping the 5th day after kit complete
Bottom side:   Max  50 line items   Top side:  Max 50 line items
Down to 0201

Equipment List
Solder Paste Printer
Pick and Place
Reflow Oven
Wave Solder
Solder Paste Inspection
AOI
BGA Rework
X-Ray
3-DX
Baking Oven
Stencil Cleaner
Aqueous Cleaner
Selective Solder

DEK
Universal
Vitronics
Vitronics
Evaluating
Evaluating
Out Source
Focal Spot
N/A
Blue M Electric Despatch
Evaluating
Technical Devices
KISS-104

Lenthor Engineering announced on Monday, September 24 their entry into the EMS arena. After 23 years of successfully fulfilling the needs of the flex and rigid-flex printed circuit board fabrication market Lenthor Engineering has, with the execution of their $850k capital expenditure plan, expanded their services to include component placement assembly. By affecting this plan, Lenthor Engineering is providing the marketplace with a single-sourced flex and rigid-flex focused board fabrication and assembly facility. The equipment procurement decisions were based on providing our customers with a very high level of technical capability supporting both production and quick-turn engineering requirements.

The equipment list contains the following:

  • DEK Solder Paste Printer
  • Universial Component Placement
  • Vitronics Reflow Oven
  • Vitronics Delta Wave Solder
  • Technical Devices Aqueous Cleaner
  • FocalSpot X-Ray
  • KISS 104 Selective Solder

The resulting equipment offering provides our customers with the ability to meet a wide range of component placement needs:

  • 0201 Component Package
  • 0.4mm (16 mil) Pitch
  • Through Hole
  • BGA, CCGA, CSP and Odd Shape Connector
  • Lead Free (RoHS Compliant)
  • Aquelous and No Clean
  • PIH (Paste in hole)
  • Press Fit Connector Installation
  • Single and Double-Sided

Now there is no more need for second guessing your fabrication and assembly source decisions.